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From December 23rd to December 27th, 2024, the Sales Operation Department organized and held the 2024 year-end sales meeting, which consisted of OBM product market planning meeting, OBM product inventory overdue backlog product plan decomposition and 2025 final version of the sales plan meeting, internal duty report meeting, sales duty report work summary and market insight meeting, annual quality issue exchange meeting, encapsulation Technical training exchange meeting, CRM demonstration and training meeting, market insight report and OBM system process management training meeting. The main participants include the company's management team, invited personnel from affiliated companies, all sales, customer service, product technology department, quality management department and packaging technology department and other related personnel, totaling more than 400 people attended.

The sales meeting was well organized and achieved good results. During the meeting, the company's leaders and sales staff addressed the OBM products in development, new products, mass production product market planning, OBM product inventory overdue backlog product plan decomposition, 2025 final version of the sales plan, 2024 external customer abnormal feedback and customer “voice”, new packaging products and a variety of adhesive sheet material process, CRM system function, market insight report and OBM system process management were exchanged for training and in-depth discussion. Synchronized sales personnel summarized and analyzed the completion of sales targets in 2024, market insight and sales targets and plans in 2025. The atmosphere of the meeting was warm, and the participants actively interacted with each other, which resulted in a lot of new sparks of ideas and concrete guidance for the smooth development of the work in the new year.

The road ahead is long and splendid. In order to better deploy the goal of 2025, Mr. Xiao emphasized: “All the sales should master the product knowledge and application areas to ensure that the business opportunities are captured; quality first, we will, as always, guard the red line of quality and build a safe bottom line; in 2025, we will still be facing greater pressure and challenges, and we need to work hard, work steadily, and be firm in our confidence, so that we can become the leader of power semiconductor industry. Continue to add bricks and mortar for Huayi to become the leader of power semiconductor industry!”